Validate cross-chip data paths in multi-die packages and evaluate the impact on power, performance, and reliability.

The transaction is backed by Andera Partners, an international private equity fund, with continued reinvestment from Walter Capital Partners and the management teams of both Averna and Spherea. The ...

1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

The push toward more complex integration in chips, advanced packaging, and the use of those chips for new applications is turning the test world upside down. Most people think of test as a single ...

In this digital world, it may be hard for some to believe that there’s still a place for anything manual or physical—especially in the engineering realm. And, while it’s true that today’s technologies ...

Dr Vrizlynn Thing, SVP, Head of Cybersecurity Strategic Technology Centre at ST Engineering, shared how cyber-resilience ...

A system-engineering approach is essential for an efficient design in a complex system. Comprehension of conflicting requirements of participating subsystems and integrated designs are key elements ...

Although digital engineering has been around for years, its use within the Pentagon has been limited. The T-7A Red Hawk is one of only a handful of programs described as “radically digital." (Boeing) ...