A new technical paper titled “The 2D Materials Roadmap” was published by researchers at many institutions including Chinese Academy of Sciences, TU Denmark, Pennsylvania State University, University ...
In a groundbreaking experiment, researchers from Tsinghua University have proven that two-dimensional (2D) semiconductor materials can withstand the harsh conditions of space. The team, led by ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback